IC Packaging Technology Expo was held at Tokyo Big Sight from January 20 to 22, 2010. This event runs concurrently with other events including Internepcon Japan (electronics manufacturing and packaging exhibition), which attracts many visitors every year. At this 11th annual expo, Sumitomo Corporation introduced its business model, which has evolved further from last year, through in-booth presentations and seminars.

Manufacturing of IC and electronics products involves the processes of product planning, design and development, Front-end processing (wafer processing), Back-end processing (assembly, inspection, etc.) and Surface mounting. Due to the huge investment required and rapid progress, these IC and electronics manufacturing processes are horizontally divided to boost development efficiency. Large IC providers have also engaged in division of labor, but it tends to be inflexible due to the difficulty of responding to the needs of individual customers (= manufacturers).

To solve such problems, Sumitomo Corporation started to provide a vertically integrated service, by collaborating with manufacturers from the product planning stage, offering flexible combinations of optimal contractors for each process. According to the project leader Shigeaki Odaka, "With highly skilled contractors, no matter how large or small, we provide flexible, timely and optimal services that satisfy manufacturers' every need. We're able to do this because we don't have our own brand IC and electronics products."

We received a high evaluation from a manufacturer for suggesting a review of the design of ICs and PCBs, based on an analysis of the cause of frequent defects in the surface mounting process. As project leader Odaka said, "Service is like playing a match with good players selected from various teams." Sumitomo Corporation will continue to help raise the competitiveness of Japanese manufacturers.