Sumitomo Corporation recently gave a special presentation at the IC PACKAGING TECHNOLOGY EXPO held at TOKYO BIG SIGHT from January 20 through 22. The event, which was held concurrently with INTERNEPCON JAPAN, attracts a great number of industry representatives keen to view demonstrations and presentations of the latest products and technologies. Exhibitors at this, the 11th annual expo, outdid themselves this year in the creativity of their promotional displays.

Representatives of Sumitomo gave an in-booth presentation on the corporation's new IC back-end processing/packaging and surface mounting services, which were launched around the end of 2008. Based on packaging services already offered to certain affiliated manufacturers, the new initiative combines the high technology, quality and cost competitiveness of domestic manufacturers specializing in packaging and surface mounting and is targeted at nonaffiliated IC manufacturers and electronics manufacturers.

The initiative is a result of partnerships with Gold Industries, Co., Ltd., SUN-A Corporation, SUN-S Co., Ltd., and Niigata Seimitsu Co., Ltd., which have made it possible to meet market needs for smaller and lighter packaging embedded with IC chips, single packages containing IC chips produced by multiple manufacturers and more. Further activities are planned to promote the new services, including presentations to various industry associations and taking every possible opportunity to take part in future exhibitions and so on.